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DRAM equipment spending surges 29% to $37 billion and NAND 28% to $14 billion in 2026, making memory the fastest-growing segment of the $135 billion WFE market.
HBM demands larger die sizes and multiple stacked memory dies, consuming disproportionately more wafer capacity than conventional DRAM and amplifying equipment requirements.
Lam Research leads with the most direct memory exposure, KLA benefits from rising defect-detection intensity, and ASML holds an unmatched EUV lithography monopoly.
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